Tape Automated Bonding (TAB)
metal conductors mounted to Mylar tape, bonded to gold bumps on die. The Mylar tape is held on reels and TAB bonded die may be automatically placed onto PC boards very efficiently. | ||||
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Tape Automated Bonding definition was found in categories: Science & Technology(1) Encyclopedia(1)
Tape Automated Bonding Definition from Science & Technology Dictionaries & Glossaries
Tape Automated Bonding Definition from Encyclopedia Dictionaries & Glossaries
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Tape-Automated Bonding
Tape-automated bonding is a process that places bare chips onto a printed circuit board (PCB) by attaching them to a polyamide film. The film is moved to the target location, and the leads are cut and soldered to the board. The bare chip is then encapsulated ("glob topped") with epoxy or plastic.
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