Flip Chip
another name for a bumped die. Bumped die are flipped over to solder them down, hence the name flip chip. | ||||
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Flip Chip Definition from Science & Technology Dictionaries & Glossaries
| Electronics Terminology |
Flip Chip
Any packaging scheme in which the active circuitry of an IC is placed facing the surface of the substrate. So A leadless structure which is designed to electrically and mechanically interconnect to the circuit by means of an appropriate number of bumps located on its face which are covered with a conductive bonding agent. Examples are flip TAB and C-4.
Any packaging scheme in which the active circuitry of an IC is placed facing the surface of the substrate. So A leadless structure which is designed to electrically and mechanically interconnect to the circuit by means of an appropriate number of bumps located on its face which are covered with a conductive bonding agent. Examples are flip TAB and C-4.
Flip Chip Definition from Encyclopedia Dictionaries & Glossaries
| Wikipedia English - The Free Encyclopedia |
Flip chip
A flip chip is one type of mounting used for semiconductor devices, such as IC chips, which does not require any wire bonds. Instead the final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry. This mounting is also known as the Controlled Collapse Chip Connection, or C4.
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