Definition of Ball bond

Integrated Circuit Terminology
Ball Bond
when a bond wire is attached to a die or leadframe one technique is to use mechanical and or thermal energy to bond the wire down by forming an intermetallic. Because the end of the wire is heated and or compressed down, a ball forms on the end of the wire at the bond. See also, a href="bword://Wirebond">wirebond.

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Ball Bond definition was found in categories: Science & Technology(1)  

Ball Bond Definition from Science & Technology Dictionaries & Glossaries

AJA_Glossary of Wireless, RF and Microwave Terms
Ball Bond (MIC)
A bond formed when a ball-shaped end interconnecting wire is deformed by thermocompression against a metallized pad. The bond is also designated a nail head bond from the appearance of the flattened ball.